mixers - dbl-bal - smt 9 9 - 348 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com hmc560lm3 gaas mmic fundamental smt mixer, 24 - 40 ghz v01.0507 general description features functional diagram wide if bandwidth: dc - 17 ghz input ip3: +21 dbm high lo/rf isolation: 35 db passive double balanced topology leadless rohs compliant smt package, 25 mm 2 electrical speci cations, t a = +25 c, if = 1 ghz, lo = +13 dbm* typical applications the hmc560lm3 is ideal for: ? test equipment & sensors ? point-to-point radios ? point-to-multi-point radios ? military & space the hmc560lm3 is a 24 - 40 ghz passive, double- balanced mmic mixer in a smt leadless chip carrier package. the mixer is fabricated in a gaas mesfet process, and can be used as a downconverter or upconverter. the wide operating bandwidth allows this device to be used across multiple radio bands with a common platform. excellent isolations are provided by on-chip baluns. the hmc560lm3 requires no external components and no dc bias. all data is with the non-hermetic, epoxy sealed lm3 package mounted in a 50 ohm test xture. utilizing the hmc560lm3 eliminates the need for wirebonding, thereby providing a consistent connection interface for the customer, and allowing the use of surface mount manufacturing techniques. parameter min. typ. ma x. min. typ. ma x. units frequency range, rf & lo 24 - 36 36 - 40 ghz frequency range, if dc - 17 dc - 17 ghz conversion loss 10 12 11 14 db noise figure (ssb) 10 12 11 14 db lo to rf isolation 25 35 22 28 db lo to if isolation 23 30 18 25 db rf to if isolation 16 20 20 25 db ip3 (input) 18 21 dbm ip2 (input) 50 40 dbm 1 db compression (input) 13 15 dbm * unless otherwise noted, all measurements performed as downconverter
mixers - dbl-bal - smt 9 9 - 349 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com conversion gain vs. temperature @ lo = +13 dbm conversion gain vs. lo drive isolation @ lo +13 dbm upconverter performance conversion gain @ lo = +13 dbm if bandwidth @ lo = +13 dbm hmc560lm3 v01.0507 -20 -15 -10 -5 0 24 26 28 30 32 34 36 38 40 42 +25 c +85 c -40 c conversion gain (db) rf frequency (ghz) -20 -15 -10 -5 0 0 2 4 6 8 10 12 14 16 18 20 conversion gain if return loss response (db) frequency (ghz) -20 -15 -10 -5 0 24 26 28 30 32 34 36 38 40 42 +7 dbm +9 dbm +11 dbm +13 dbm +15 dbm conversion gain (db) rf frequency (ghz) -20 -15 -10 -5 0 24 26 28 30 32 34 36 38 40 42 conversion gain (db) rf frequency (ghz) -50 -40 -30 -20 -10 0 24 26 28 30 32 34 36 38 40 42 lo/rf rf/if lo/if isolation (db) frequency (ghz) return loss @ lo = +13 dbm -20 -15 -10 -5 0 24 26 28 30 32 34 36 38 40 rf lo return loss (db) frequency (ghz) gaas mmic fundamental smt mixer, 24 - 40 ghz
mixers - dbl-bal - smt 9 9 - 350 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com input ip2 vs. lo drive* input ip2 vs. temperature @ lo = +13 dbm* input ip3 vs. temperature @ lo = +13 dbm* input p1db vs. temperature @ lo = +13 dbm input ip3 vs. lo drive* * two-tone input power = -10 dbm each tone, 1 mhz spacing. hmc560lm3 v01.0507 0 10 20 30 40 50 60 70 80 24 26 28 30 32 34 36 38 40 +25 c +85 c -40 c iip2 (dbm) rf frequency (ghz) 0 10 20 30 40 50 60 70 80 24 26 28 30 32 34 36 38 40 +9 dbm +11 dbm +13 dbm +15 dbm iip2 (dbm) rf frequency (ghz) 0 5 10 15 20 24 26 28 30 32 34 36 38 40 +25 c +85 c -40 c p1db (dbm) rf frequency (ghz) 0 5 10 15 20 25 24 26 28 30 32 34 36 38 40 +25 c +85 c -40 c iip3 (dbm) rf frequency (ghz) 0 5 10 15 20 25 24 26 28 30 32 34 36 38 40 +9 dbm +11 dbm +13 dbm +15 dbm iip3 (dbm) rf frequency (ghz) upconverter performance input ip3 @ lo = +13 dbm 0 5 10 15 20 25 24 26 28 30 32 34 36 38 40 iip3 (dbm) rf frequency (ghz) gaas mmic fundamental smt mixer, 24 - 40 ghz
mixers - dbl-bal - smt 9 9 - 351 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com absolute maximum ratings electrostatic sensitive device observe handling precautions outline drawing notes: 1. material: plastic 2. plating: gold over nickel 3. all dimensions in inches (millimeters) 4. all tolerances are 0.005 (0.13) 5. all grounds must be soldered to pcb rf ground 6. ? indicates pin 1 rf / if input +25 dbm lo drive +23 dbm if dc current 2 ma channel temperature 150 c/w continuous pdiss (t= 85 c ) (derate 5.3 mw/ c above 85 c) 0.344 w thermal resistance (r th ) (channel to package bottom) 188 c/w storage temperature -65 to +150 c operating temperature -55 to +85 c hmc560lm3 v01.0507 mxn spurious outputs as a down converter nlo mrf01234 0xx-55 13025 258484958 378736383 4888589 rf = 24 ghz @ -10 dbm lo = 25 ghz @ +13 dbm all values in dbc below if output power level. gaas mmic fundamental smt mixer, 24 - 40 ghz
mixers - dbl-bal - smt 9 9 - 352 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com pin number function description interface schematic 1, 2, 3 n/c this pin may be connected to the pcb ground or left unconnected. 4rf this pin is dc coupled and matched to 50 ohms. 5if this pin is dc coupled. for applications not requiring opera- tion to dc, this port should be dc blocked externally using a series capacitor whose value has been chosen to pass the necessary if frequency range. for operation to dc, this pin must not source or sink more than 2 ma of current or part non-function and possible part failure will result. 6lo this pin is dc coupled and matched to 50 ohms. gnd package base must be soldered to pcb rf ground. pin descriptions hmc560lm3 v01.0507 gaas mmic fundamental smt mixer, 24 - 40 ghz
mixers - dbl-bal - smt 9 9 - 353 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com evaluation pcb evaluation circuit board layout design details layout technique micro strip to cpwg material rogers 4003 with 1/2 oz. cu dielectric thickness 0.008 (0.20 mm) microstrip line width 0.018 (0.46 mm) cpwg line width 0.016 (0.41 mm) cpwg line to gnd gap 0.005 (0.13 mm) ground via hole diameter 0.008 (0.20 mm) the grounded co-planar wave guide (cpwg) pcb input/output transitions allow use of ground-signal-ground (gsg) probes for testing. suggested probe pitch is 400 mm (16 mils). alternatively, the board can be mounted in a metal housing with 2.4 mm coaxial connectors. lm3 package mounted to evaluation pcb hmc560lm3 v01.0507 gaas mmic fundamental smt mixer, 24 - 40 ghz
mixers - dbl-bal - smt 9 9 - 354 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com suggested lm3 pcb land pattern notes: 1. dimensions are in inches [millimeters] 2. pad width shown is for soldering only. beyond soldering area all conductors that carry rf and microwave signals should have 50 ohm characteristic impedance. hmc560lm3 v01.0507 gaas mmic fundamental smt mixer, 24 - 40 ghz
mixers - dbl-bal - smt 9 9 - 355 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com recommended smt attachment technique preparation & handling of the lm3 millimeterwave package for surface mounting the hmc lm3 package was designed to be compatible with high volume surface mount pcb assembly processes. the lm3 package requires a speci c mounting pattern to allow proper mechanical attachment and to optimize electrical performance at millimeterwave frequencies. this pcb layout pattern can be found on each lm3 product data sheet. it can also be provided as an electronic drawing upon request from hittite sales & application engineering. follow these precautions to avoid permanent damage: cleanliness: observe proper handling procedures to ensure clean devices and pcbs. lm3 devices should remain in their original packaging until component placement to ensure no contamination or damage to rf, dc & ground contact areas. static sensitivity: follow esd precautions to protect against esd strikes. general handling: handle the lm3 package on the top with a vacuum collet or along the edges with a sharp pair of bent tweezers. avoiding damaging the rf, dc, & ground contacts on the package bottom. do not apply excess pressure to the top of the lid. solder materials & temperature pro le: follow the information contained in the application note. hand soldering is not recommended. conductive epoxy attachment is not recommended. sold er paste: sold er paste should be sele c ted based on the user s ex perien c e and be c om patible with the metallization systems used. see the lm3 data sheet outline drawing for pin & ground contact metallization schemes. solder paste application: solder paste is generally applied to the pcb using either a stencil printer or dot placement. the volume of solder paste will be dependent on pcb and component layout and should be controlled to ensure consistent mechanical & electrical performance. excess solder may create unwanted electrical parasitics at high frequencies. solder re ow: the soldering process is usually accomplished in a re ow oven but may also use a vapor phase process. a solder re ow pro le is suggested above. prior to re owing product, temperature pro les should be measured using the same mass as the actual assemblies. the thermocouple should be moved to various positions on the board to account for edge and corner effects and varying component masses. the nal pro le should be determined by mounting the thermocouple to the pcb at the location of the device. follow solder paste and oven vendors recommendations when developing a solder re ow pro le. a standard pro le will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. allow enough time between reaching pre-heat temperature and re ow for the solvent in the paste to evaporate and the ux to completely activate. re ow must then occur prior to the ux being completely driven off. the duration of peak re ow temperature should not exceed 15 seconds. packages have been quali ed to withstand a peak temperature of 235c for 15 seconds. verify that the pro le will not expose device to temperatures in excess of 235c. cleaning: a water-based ux wash may be used. 25 50 75 100 125 150 175 200 225 012345678 temperature ( 0 c) time (min) hmc560lm3 v01.0507 gaas mmic fundamental smt mixer, 24 - 40 ghz
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